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Proceedings Paper

Standards for hybrid microsystems production equipment
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Paper Abstract

The microsystems field has seen only few standardization efforts so far. Si-based microtechnology profits from standardization in semiconductor technology mainly undertaken by SEMI. There is virtually no standardization neither for equipment nor for components in the Non-Si microtechnology. The main reason for this situation is the large variety of microcomponent shapes, sizes, materials, as well as manufacturing and assembly processes. While electronic assembly equipment is applicable for assembly as long as the microcomponents are chip-like such as pressure sensors, gas sensor arrays etc. the situation is different for hybrid microsystems, such as micro-optical and micro-fluidic systems. These systems are made up of microcomponents of different shapes and materials. This inherent variety has led to number of tailor made solutions, but to no real standardization of components or equipment so far. The German association of machine and plant manufacturers (VDMA) and the German standardization committee DIN NAFuO AA F3 have started standardization projects in the field of component and equipment standardization. These projects are supported by joint research projects.

Paper Details

Date Published: 8 October 2001
PDF: 7 pages
Proc. SPIE 4568, Microrobotics and Microassembly III, (8 October 2001); doi: 10.1117/12.444136
Show Author Affiliations
Ulrich K. Gengenbach, Forschungszentrum Karlsruhe GmbH (Germany)


Published in SPIE Proceedings Vol. 4568:
Microrobotics and Microassembly III
Bradley J. Nelson; Jean-Marc Breguet, Editor(s)

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