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Proceedings Paper

Microassembly station with controlled environment
Author(s): Quan Zhou; Albut Aurelian; Carlos del Corral; Pedro J. Esteban; Pasi Kallio; Bo Chang; Heikki N. Koivo
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Paper Abstract

With the trend of miniaturization of mechatronics products, the demands on microassembly increase substantially. Due to the scaling effect, handling and planning in microassembly is considerably different from those in conventional assembly. One important issue is to study how the environmental parameters will shape the scaling effect and consequently the handling of micro parts. A controlled environment will enable a better understanding of the handling tasks in microassembly and consequently provide a necessary tool for the development of model-based microassembly methods. Moreover, environmental parameters can affect the performance of microassembly system. This paper will present our progress of developing a microassembly station with controlled environment. The microassembly station includes a microassembly platform that is able to mount various tools such as microscopes, mobile stages, micro grippers, etc. The microassembly platform is installed in a controlled environment where temperature and humidity can be controlled, and mechanical vibration is damped. Such a microassembly station facilitates researching microassembly methods and techniques under different environmental conditions. Early study of the effects of environmental parameters to microassembly system and pick-and-place operation is reported as well.

Paper Details

Date Published: 8 October 2001
PDF: 9 pages
Proc. SPIE 4568, Microrobotics and Microassembly III, (8 October 2001); doi: 10.1117/12.444132
Show Author Affiliations
Quan Zhou, Tampere Univ. of Technology (Finland)
Albut Aurelian, Tampere Univ. of Technology (Finland)
Carlos del Corral, Tampere Univ. of Technology (Finland)
Pedro J. Esteban, Tampere Univ. of Technology (Finland)
Pasi Kallio, Tampere Univ. of Technology (Finland)
Bo Chang, Tampere Univ. of Technology (Finland)
Heikki N. Koivo, Helsinki Univ. of Technology (Finland)


Published in SPIE Proceedings Vol. 4568:
Microrobotics and Microassembly III
Bradley J. Nelson; Jean-Marc Breguet, Editor(s)

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