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Proceedings Paper

Embedded electronics for a 64-channel wireless brain implant
Author(s): Johann D. Burgert; Jan Malasek; Sylvain M. Martel; Colette Wiseman; Timothy Fofonoff; Robert Dyer; Ian Warwick Hunter; Nicholas Hatsopoulos; John Donoghue
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Paper Abstract

The Telemetric Electrode Array System (TEAS) is a surgically implantable device for the study of neural activity in the brain. An 8x8 array of electrodes collects intra-cortical neural signals and connects them to an analog front end. The front end amplifies and digitizes these microvolt-level signals with 12 bits of resolution and at 31KHz per channel. Peak detection is used to extract the information carrying features of these signals, which are transmitted over a Bluetooth-based radio link at 725 Kbit/sec. The electrode array is made up of 1mm tall, 60-micron square electrodes spaced 500 microns tip-to-tip. A flex circuit connector provides mechanical isolation between the brain and the electronics, which are mounted to the cranium. Power consumption and management is a critical aspect of the design. The entire system must operate off a surgically implantable battery. With this power source, the system must provide the functionality of a wireless, 64-channel oscilloscope for several hours. The system also provides a low-power sleep mode during which the battery can be inductively charged. Power dissipation and biocompatibility issues also affect the design of the electronics for the probe. The electronics system must fit between the skull and the skin of the test subject. Thus, circuit miniaturization and microassembly techniques are essential to construct the probe's electronics.

Paper Details

Date Published: 8 October 2001
PDF: 11 pages
Proc. SPIE 4568, Microrobotics and Microassembly III, (8 October 2001); doi: 10.1117/12.444119
Show Author Affiliations
Johann D. Burgert, Massachusetts Institute of Technology (United States)
Jan Malasek, Massachusetts Institute of Technology (United States)
Sylvain M. Martel, Massachusetts Institute of Technology (United States)
Colette Wiseman, Massachusetts Institute of Technology (United States)
Timothy Fofonoff, Massachusetts Institute of Technology (United States)
Robert Dyer, Massachusetts Institute of Technology (United States)
Ian Warwick Hunter, Massachusetts Institute of Technology (United States)
Nicholas Hatsopoulos, Brown Univ. (United States)
John Donoghue, Brown Univ. (United States)


Published in SPIE Proceedings Vol. 4568:
Microrobotics and Microassembly III
Bradley J. Nelson; Jean-Marc Breguet, Editor(s)

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