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Proceedings Paper

Development of advanced micromirror arrays by flip-chip assembly
Author(s): M. Adrian Michalicek; Victor M. Bright
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Paper Abstract

This paper presents the design, commercial prefabrication, modeling and testing of advanced micromirror arrays fabricated using a novel, simple and inexpensive flip-chip assembly technique. Several polar piston arrays and rectangular cantilever arrays were fabricated using flip-chip assembly by which the upper layers of the array are fabricated on a separate chip and then transferred to a receiving module containing the lower layers. Typical polar piston arrays boast 98.3% active surface area, highly planarized surfaces, low address potentials compatible with CMOS electronics, highly standardized actuation between devices, and complex segmentation of mirror surfaces which allows for custom aberration configurations. Typical cantilever arrays boast large angles of rotation as well as an average surface planarity of only 1.779 nm of RMS roughness across 100 +m mirrors. Continuous torsion devices offer stable operation through as much as six degrees of rotation while binary operation devices offer stable activated positions with as much as 20 degrees of rotation. All arrays have desirable features of costly fabrication services like five structural layers and planarized mirror surfaces, but are prefabricated in the less costly MUMPs process. Models are developed for all devices and used to compare empirical data.

Paper Details

Date Published: 2 October 2001
PDF: 12 pages
Proc. SPIE 4561, MOEMS and Miniaturized Systems II, (2 October 2001); doi: 10.1117/12.443105
Show Author Affiliations
M. Adrian Michalicek, Univ. of Colorado/Boulder (United States)
Victor M. Bright, Univ. of Colorado/Boulder (United States)

Published in SPIE Proceedings Vol. 4561:
MOEMS and Miniaturized Systems II
M. Edward Motamedi; Rolf Goering, Editor(s)

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