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Proceedings Paper

Thermal management in optical MEMS
Author(s): Joseph J. Talghader
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Paper Abstract

Micromachined devices are often connected to their underlying substrate by only a few small beams and are susceptible to a host of unwanted thermal effects. For many non-optical structures, thermal degradation begins with buckling or catastrophic thermal breakdown. In optical devices, however, the wavelength of light places an upper limit on the acceptable mechanical deformation, and large aberrations can be induced by relatively small changes in shape. Calculating quantitative limits on the incident optical power, applied current, and operating temperature of a device will require a strong understanding of its heat transfer and elastic response. This paper discusses the heat transfer and thermal deformation of optical MEMS components. First, the thermal conductance of microfilaments and micromirrors is discussed followed by a treatment of the thermal expansion deformation of micromirrors with temperature. Finally, mirror shape stabilization using stress compensation and thermal conductance control using electrostatic actuation are summarized.

Paper Details

Date Published: 2 October 2001
PDF: 8 pages
Proc. SPIE 4561, MOEMS and Miniaturized Systems II, (2 October 2001); doi: 10.1117/12.443090
Show Author Affiliations
Joseph J. Talghader, Univ. of Minnesota/Twin Cities (United States)


Published in SPIE Proceedings Vol. 4561:
MOEMS and Miniaturized Systems II
M. Edward Motamedi; Rolf Goering, Editor(s)

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