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Proceedings Paper

Flip-chip fabrication of integrated micromirror arrays using a novel latching off-chip hinge mechanism
Author(s): M. Adrian Michalicek; Victor M. Bright
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Paper Abstract

This paper presents the design, fabrication, modeling, and testing of various arrays of cantilever micromirror devices integrated atop CMOS control electronics. The upper layers of the arrays are prefabricated in the MUMPs process and then flip-chip transferred to CMOS receiving modules using a novel latching off-chip hinge mechanism. This mechanism allows the micromirror arrays to be released, rotated off the edge of the host module and then bonded to the receiving module using a standard probe station. The hinge mechanism supports the arrays by tethers that are severed to free the arrays once bonded. The resulting devices are inherently planarized since the bottom of the first releasable MUMPs layer becomes the surface of the integrated mirror. The working devices are formed by mirror surfaces bonded to address electrodes fabricated above static memory cells on the CMOS module. These arrays demonstrate highly desirable features such as compatible address potentials, less than 2 nm of RMS roughness, approximately 1 micrometers of lateral position accuracy and the unique ability to metallize reflective surfaces without masking. Ultimately, the off-chip hinge mechanism enables very low-cost, simple, reliable, repeatable and accurate assembly of advanced MEMS and integrated microsystems without specialized equipment or complex procedures.

Paper Details

Date Published: 2 October 2001
PDF: 12 pages
Proc. SPIE 4561, MOEMS and Miniaturized Systems II, (2 October 2001); doi: 10.1117/12.443088
Show Author Affiliations
M. Adrian Michalicek, Univ. of Colorado/Boulder (United States)
Victor M. Bright, Univ. of Colorado/Boulder (United States)


Published in SPIE Proceedings Vol. 4561:
MOEMS and Miniaturized Systems II
M. Edward Motamedi; Rolf Goering, Editor(s)

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