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Proceedings Paper

Construction of a microfluidic bistable fluid amplifier using the nickel electroforming method
Author(s): Narciso F. Macia
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Paper Abstract

This paper presents a method for creating planar, fluidic devices by bonding together laminations created with the nickel electroforming method. The fluid amplifier is created by sandwiching together several, several .001 inch [25.4 microns] thick laminations. These laminations contain the fluid amplifier, vents and transfer channels. The laminations are initially coated with an adhesive, which acts as a bonding agent when subjected to heat. Special pins are used to insure proper alignment. The entire process is performed in a clean room environment to minimize problems. The proportional fluid amplifier is made bi-stable by introducing positive feedback.

Paper Details

Date Published: 28 September 2001
PDF: 11 pages
Proc. SPIE 4560, Microfluidics and BioMEMS, (28 September 2001); doi: 10.1117/12.443068
Show Author Affiliations
Narciso F. Macia, Arizona State Univ. (United States)

Published in SPIE Proceedings Vol. 4560:
Microfluidics and BioMEMS
Carlos H. Mastrangelo; Holger Becker, Editor(s)

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