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Proceedings Paper

Novel MEMS devices and silicon micromachined components for high-frequency circuits
Author(s): Linda P.B. Katehi
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Paper Abstract

This paper discusses recent developments in MEMS devices and Si-micromachined circuits. Specifically, the issue of poor isolation in individual MEMS switches is addressed in the context on creative designs that lead to the development of very-high isolation MEMS switch architectures operating in a very broad frequency range. Furthermore, Si-micromachined circuits appropriate for use in modern communications systems are described, and novel K- thru W-band 3D multi- layer architectures are presented.

Paper Details

Date Published: 1 October 2001
PDF: 6 pages
Proc. SPIE 4559, MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication, (1 October 2001); doi: 10.1117/12.443041
Show Author Affiliations
Linda P.B. Katehi, Univ. of Michigan (United States)


Published in SPIE Proceedings Vol. 4559:
MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication
Henry Helvajian; Siegfried W. Janson; Franz Laermer, Editor(s)

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