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Proceedings Paper

Single-layer silicon-on-insulator MEMS gyroscope for wide dynamic range and harsh environment applications
Author(s): Michael S. Kranz; Tracy Dean Hudson; Paul R. Ashley; Paul B. Ruffin; Sherrie J. Burgett; Mark Temmen; Jerry Tuck
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Paper Abstract

The Army Aviation and Missile Command (AMCOM), Morgan Research Corporation, and Aegis Research Corporation are developing an SOI-based vibratory-rate z-axis MEMS gyroscope utilizing force-feedback control, and intended for wide dynamic range and harsh environment applications. Rate sensing in small diameter ballistic missile guidance units requires a rate resolution of less than 1 degree(s)/hr over a range of -3000 to +3000 degree(s)/sec, resulting in a dynamic range of 107. In addition, the devices must operate through military specifications on temperature (-55 degree(s)C to +125 degree(s)C) and vibration (1000 g at 5 - 15 kHz). This paper presents modeling, simulation, and fabrication efforts, as well as initial test data, for an SOI-based rate sensor intended for this application. The prototyped gyroscope is a single layer structure consisting of a proof mass placed in a three-fold mode-decoupled symmetric suspension. The device is fabricated in a cost-effective and highly-controllable Silicon-on-Insulator (SOI) process for in-plane inertial devices. The mechanical structure is integrated in a vacuum-sealed hermetic package with a separate CMOS readout ASIC. At the present time, the device has undergone two design iterations, with the most recent just completed.

Paper Details

Date Published: 1 October 2001
PDF: 12 pages
Proc. SPIE 4559, MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication, (1 October 2001); doi: 10.1117/12.443029
Show Author Affiliations
Michael S. Kranz, Morgan Research Corp. (United States)
Tracy Dean Hudson, U.S. Army Aviation and Missile Command (United States)
Paul R. Ashley, U.S. Army Aviation and Missile Command (United States)
Paul B. Ruffin, U.S. Army Aviation and Missile Command (United States)
Sherrie J. Burgett, U.S. Army Aviation and Missile Command (United States)
Mark Temmen, The Aegis Technologies Group, Inc. (United States)
Jerry Tuck, The Aegis Technologies Group, Inc. (United States)


Published in SPIE Proceedings Vol. 4559:
MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication
Henry Helvajian; Siegfried W. Janson; Franz Laermer, Editor(s)

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