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Proceedings Paper

MEMS multisensor system for flight testing
Author(s): Minas H. Tanielian
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Paper Abstract

With recent developments in micromachining technology, fabrication of discrete microdevices is maturing; consequently, system integration is becoming an ever more important issue. One obstacle to such systems is the diverse power requirements of microdevices, especially actuators. Since some types of actuators exhibit relatively high voltage or power requirements, it is not feasible to integrate power supplies on-chip, and it is often inconvenient for the MEMS system to be tethered to interconnects for purposes of supplying power. On-chip wireless power sources can be implemented to circumvent this problem. Here, a simple wireless powering scheme, which utilizes a transformer with an air gap in its core, is demonstrated. The transformer secondary is fabricated on-chip and is detachable from the transformer. Experiments and simulations are performed to maximize the coupling between the primary and secondary. Coupling coefficient close to 0.8 was obtained. Frequency properties of the transformer were studied. In the case of the thin-film secondaries demonstrated here, the transformer operates at frequencies less than a few MHz. Usably high voltage (223.4 Vpp) and high power delivered to a load (4.5 Wrms) were obtained from the secondary to demonstrate the transformer capabilities.

Paper Details

Date Published: 1 October 2001
PDF: 10 pages
Proc. SPIE 4559, MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication, (1 October 2001); doi: 10.1117/12.443026
Show Author Affiliations
Minas H. Tanielian, The Boeing Co. (United States)

Published in SPIE Proceedings Vol. 4559:
MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication
Henry Helvajian; Siegfried W. Janson; Franz Laermer, Editor(s)

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