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Proceedings Paper

Micromachined pressure gauge for the vacuum range based on damping of a resonator
Author(s): Steffen Kurth; Karla Hiller; Norbert Zichner; Jan Mehner; Thomas Iwert; Steffen Biehl; Wolfram Doetzel; Thomas Gessner
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Paper Abstract

Vacuum pressure measuring has been a field low permeated by micromachined devices until now. We designed a micromachined resonating system for friction vacuum gauge and tested it with the related electronics. The Silicon resonator is electrostically driven and capacitively sensed. Working at the fundamental resonant frequency (14 kHz), the damping of the oscillation is a measure for the pressure. We use bulk micromaching for the fabrication of the sensor cells. They consist of two fusion bonded silicon layers forming the resonator and two anodically bonded glass layers for caring sensing electrodes. A modified tuning fork design has been used for the resonator. It has a mechanical Q-factor of 33.000 at the low measurement range. The electronic circuit consists of a phase locked loop for driving at resonance and a PI controller to keep a constant vibration magnitude. The sensor has a nearly logarithmic transfer in a vacuum pressure range of 10-3 mbar ... 100 mbar.

Paper Details

Date Published: 1 October 2001
PDF: 9 pages
Proc. SPIE 4559, MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication, (1 October 2001); doi: 10.1117/12.443024
Show Author Affiliations
Steffen Kurth, Fraunhofer Institute for Reliability and Micro Integration (Germany)
Karla Hiller, Fraunhofer Institute for Reliability and Micro Integration (Germany)
Norbert Zichner, Chemnitz University of Technology (Germany)
Jan Mehner, Chemnitz University of Technology (Germany)
Thomas Iwert, u-Sen Mikrosystemtechnik GmbH (Germany)
Steffen Biehl, u-Sen Mikrosystemtechnik GmbH (Germany)
Wolfram Doetzel, Chemnitz University of Technology (Germany)
Thomas Gessner, Chemnitz University of Technology (Germany)


Published in SPIE Proceedings Vol. 4559:
MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication
Henry Helvajian; Siegfried W. Janson; Franz Laermer, Editor(s)

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