Share Email Print
cover

Proceedings Paper

Characterization of MEMS mechanical properties using nanoscale techniques
Author(s): Nicholas X. Randall; Richard A. J. Soden
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

This paper focuses on recent developments in the localised characterisation of the mechanical properties of Microsystems and MEMS devices and structures. Indentation techniques provide a highly powerful method for measuring the load and depth response of very small micro-machined silicon structures. Beam structures, such as are used for accelerometers, need to be characterised in terms of the number of cycles to failure, the spring constant or the energy required to bend the beam by a required amount. Such localised testing needs to be adapted to work at various distances from the origin of the beam with a positioning accuracy of less than a micron. Initial studies have proved to be highly repeatable. A range of examples is presented which cover a range of application areas, including accelerometer beam structures, microswitches and printer head structures. The basic instrumental concepts are explained together with the modifications required for testing small structures in a localised way.

Paper Details

Date Published: 2 October 2001
PDF: 8 pages
Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); doi: 10.1117/12.443015
Show Author Affiliations
Nicholas X. Randall, CSEM Instruments S.A. (Switzerland)
Richard A. J. Soden, CSEM Instruments S.A. (Switzerland)


Published in SPIE Proceedings Vol. 4558:
Reliability, Testing, and Characterization of MEMS/MOEMS
Rajeshuni Ramesham, Editor(s)

© SPIE. Terms of Use
Back to Top