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Proceedings Paper

Physical and reliability issues in MEMS microrelays with gold contacts
Author(s): Xavier Lafontan; Francis Pressecq; Guy Perez; Christian Dufaza; Jean Michel Karam
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Paper Abstract

This paper presents the work we have done on micro-relays with gold micro-contacts in MUMPs. Firstly, the theoretical physical principles of MEMS micro-relay are described. This study is divided in two parts: the micro-contact and the micro-actuator. The micro-contact part deals with resistance of constriction, contact area, adhesion, arcing and wear. Whereas the micro-actuator part describes general principles, contact force, restoring force and actuator reliability. Then, in a second part, an innovative electrostatic relay design in MUMPs is presented. The concept, the implementation and the final realization are discussed. Then, in the third part, characterization results are reported. This part particularly focuses on the micro-contact study. Conduction mode, contact area, mechanical and thermal deformation, and adhesion energies are presented.

Paper Details

Date Published: 2 October 2001
PDF: 11 pages
Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); doi: 10.1117/12.443006
Show Author Affiliations
Xavier Lafontan, Ctr. National d'Etudes Spatiales and LIMRR/CNRS (France)
Francis Pressecq, Ctr. National d'Etudes Spatiales (France)
Guy Perez, Ctr. National d'Etudes Spatiales (France)
Christian Dufaza, LIMRR/CNRS (France)
Jean Michel Karam, MEMSCAP S.A. (France)


Published in SPIE Proceedings Vol. 4558:
Reliability, Testing, and Characterization of MEMS/MOEMS
Rajeshuni Ramesham, Editor(s)

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