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Proceedings Paper

Fracture toughness and fatigue investigations of polycrystalline silicon
Author(s): Joerg Bagdahn; Jan Schischka; Matthias Petzold; William N. Sharpe
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Paper Abstract

The fracture toughness of micromachined polycrystalline silicon samples, pre-cracked with an indenter or notched using a focused ion beam (FIB) machine, were tested using either bending or tensile loading. Fracture mechanics approaches were applied to determine the fracture toughness from these results. For the pre-cracked specimens tested by tensile loading, a fracture toughness value of KI,crit equals 0.86 MP(root)a derived. The FIB notched specimens had higher fracture toughness values, probably due to the influence of the notch tip radius and the FIB process. In addition, fatigue investigations of un-notched tensile specimens were performed using tensile cyclic loading with frequencies of 50, 200 and 1000 Hz. A reduction in the tensile strength from 1.10 GPa to 0.75 GPa after 108 cycles was detected while no influence of the test frequency on the fatigue behavior was observed.

Paper Details

Date Published: 2 October 2001
PDF: 10 pages
Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); doi: 10.1117/12.442998
Show Author Affiliations
Joerg Bagdahn, Johns Hopkins Univ. (United States)
Jan Schischka, Fraunhofer-Institut fuer Werkstoffmechanik (Germany)
Matthias Petzold, Fraunhofer-Institut fuer Werkstoffmechanik (Germany)
William N. Sharpe, Johns Hopkins Univ. (United States)

Published in SPIE Proceedings Vol. 4558:
Reliability, Testing, and Characterization of MEMS/MOEMS
Rajeshuni Ramesham, Editor(s)

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