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Proceedings Paper

Reliability of self-assembled 3D microstructures: dynamic snap-through modeling and experimental validation
Author(s): Olivier Millet; Lionel Buchaillot; Emmanuel Quevy; Dominique Collard
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Paper Abstract

The reliability study of advanced 3D self-assembled micro- machined polysilicon structures is investigated here with the aim of preventing the dynamic snap-through from occurring; snap-through is a vibratory phenomenon, which can lead to the destruction of a whole structure. 3D polysilicon micro-parts are self-assembled by beam buckling induced by the compressive force produced by Scratch Drive Actuator; this work considers the reliability of these micro-parts, and particularly the response of homogeneous, clamped- clamped polysilicon microfabricated buckled beams.

Paper Details

Date Published: 2 October 2001
PDF: 11 pages
Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); doi: 10.1117/12.442991
Show Author Affiliations
Olivier Millet, Institut d'Electronique et de Micro-Electronique du Nord (France)
Lionel Buchaillot, Institut d'Electronique et de Micro-Electronique du Nord (Japan)
Emmanuel Quevy, Institut d'Electronique et de Micro-Electronique du Nord (France)
Dominique Collard, Institut d'Electronique et de Micro-Electronique du Nord (France)


Published in SPIE Proceedings Vol. 4558:
Reliability, Testing, and Characterization of MEMS/MOEMS
Rajeshuni Ramesham, Editor(s)

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