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Proceedings Paper

Orthogonal method for processing of SU-8 resist in UV-LIGA
Author(s): Jingquan Liu; Jun Zhu; Guipu Ding; Xiaolin Zhao; Bingchu Cai
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Paper Abstract

SU-8 is a negative, epoxy type, near-UV photoresist. The resist has been specifically developed for ultrathick, high-aspect-ratio MEMS-type applications. It has been proven to be very sensitive to process variations. In this paper, the orthogonal method is used in the process. While three processing parameters are used as control factors, experiments are performed and results are evaluated. As the results being analyzed, a proposed fabrication process is derived from optimizing the control factors. The output structure has straight sidewall profile, fine line and space resolution, and strong adhesion to substrate. The aspect ratio can be greater than 20 in the 200-um-thick resist. Furthermore, several metallic films are used as the substrates. The titanium film with oxidation treatment is found to have the stronger adhesion to the resist. The result will open possibilities for low-cost LIGA-type process for MEMS applications.

Paper Details

Date Published: 28 September 2001
PDF: 5 pages
Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); doi: 10.1117/12.442980
Show Author Affiliations
Jingquan Liu, Shanghai Jiao Tong Univ. (China)
Jun Zhu, Shanghai Jiao Tong Univ. (China)
Guipu Ding, Shanghai Jiao Tong Univ. (China)
Xiaolin Zhao, Shanghai Jiao Tong Univ. (China)
Bingchu Cai, Shanghai Jiao Tong Univ. (China)

Published in SPIE Proceedings Vol. 4557:
Micromachining and Microfabrication Process Technology VII
Jean Michel Karam; John A. Yasaitis, Editor(s)

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