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Proceedings Paper

Multilevel microstructures and mold inserts fabricated with planar and oblique x-ray lithography of SU-8 negative photoresist
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Paper Abstract

For patterning thick photoresist films, x-ray lithography is superior to optical lithography because of the use of a shorter wavelength and a very large depth of focus. SU-8 negative resist is well suited to pattern tall, high-aspect ratio microstructures in UV optical and x-ray lithography with rapid prototyping capability due to its high sensitivity. The negative tone of the SU-8 resist offers advantages in fabricating multi-level and non-planar microstructures using x-ray lithography or a combination of x-ray and UV optical lithography. In this paper, we present a fabrication process for multi-level metallic mold insert by a combination of multi-layer SU-8 patterning, poly-dimethylsiloxane (PDMS) molding, and nickel electroplating to make final nickel mold inserts that are suitable for injection molding and hot embossing of plastics and ceramics.

Paper Details

Date Published: 28 September 2001
PDF: 8 pages
Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); doi: 10.1117/12.442979
Show Author Affiliations
Linke Jian, Louisiana State Univ. (Germany)
Yohannes M. Desta, Louisiana State Univ. (United States)
Jost Goettert, Louisiana State Univ. (United States)


Published in SPIE Proceedings Vol. 4557:
Micromachining and Microfabrication Process Technology VII
Jean Michel Karam; John A. Yasaitis, Editor(s)

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