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Proceedings Paper

Progress on 300-mm wafer lithography equipment and processes
Author(s): Karl E. Mautz; John G. Maltabes
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Paper Abstract

SEMICONDUCTOR300 was the first pilot-production facility for 300mm wafers in the world. The company, a joint venture between Motorola, Inc. and Infineon Technologies started in early 1998 to test and compare process, metrology and probe equipment, develop robust processes, and manufacture products using a 300mm wafer tool set. The lithography tools included I-line steppers, an I-line scanner, a DUV stepper, and DUV scanners. All of these exposure tools were running in-line with various photoresist coat and develop tracks. The lithography tools were used to build both 64M and 256M DRAM devices and aggressive test vehicles. The process capability of the initial 0.25 micrometers reference process was done and compared to the 200mm data set of the sister factory. Automation issues for lithography tools were addressed and the cost metrics were calculated. SC300 demonstrated that a manufacturable 300mm lithography tool set and process for various ground rule devices was possible with the required performance in image transfer, CD control, and overlay. Further testing on 0.18micrometers and 0.15micrometers ground rule features indicated a sufficient process window for potential manufacturing. Additionally, it was demonstrated that non-concentric subfield stepping was feasible.

Paper Details

Date Published: 28 September 2001
PDF: 13 pages
Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); doi: 10.1117/12.442959
Show Author Affiliations
Karl E. Mautz, Motorola (United States)
John G. Maltabes, Motorola (United States)

Published in SPIE Proceedings Vol. 4557:
Micromachining and Microfabrication Process Technology VII
Jean Michel Karam; John A. Yasaitis, Editor(s)

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