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Proceedings Paper

Young's modulus measurement of aluminum thin film with cantilever structure
Author(s): ByoungChan Lee; SangHun Lee; Hwasu Lee; Hyungjae Shin
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Paper Abstract

Micromachined cantilever structures are commonly used for measuring mechanical properties of thin film materials in MEMS. The application of conventional cantilever theory in experiment raises severe problem. The deformation of the supporting post and flange is produced by the applied electrostatic force and lead to more reduced measurement value than real Youngí»s modulus of thin film materials. In order to determine Youngí»s modulus of aluminum thin film robustly and reproducibly, the modified cantilever structure is proposed. Two measurement methods, which are cantilever tip deflection measurement and resonant frequency measurement, are used for confirming the reliability of the proposed cantilever structure as well. Measured results indicate that the proposed measurement scheme provides useful and credible Youngí»s modulus value for thin film materials with sub-micron thickness. The proved validation of the proposed scheme makes sure that in addition to Youngí»s modulus of aluminum thin film, that of other thin film materials which are aluminum alloy, metal, and so forth, can be extracted easily and clearly.

Paper Details

Date Published: 28 September 2001
PDF: 8 pages
Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); doi: 10.1117/12.442949
Show Author Affiliations
ByoungChan Lee, Samsung Advanced Institute of Technology (South Korea)
SangHun Lee, Samsung Advanced Institute of Technology (South Korea)
Hwasu Lee, Samsung Advanced Institute of Technology (South Korea)
Hyungjae Shin, Samsung Advanced Institute of Technology (South Korea)


Published in SPIE Proceedings Vol. 4557:
Micromachining and Microfabrication Process Technology VII
Jean Michel Karam; John A. Yasaitis, Editor(s)

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