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Proceedings Paper

Gold damascene interconnect technology for millimeter-wave photonics on silicon
Author(s): Hiromu Ishii; Shouji Yagi; Tadashi Minotani; Yakov Royter; Kazuhisa Kudou; Masaki Yano; Tadao Nagatsuma; Katsuyuki Machida; Hakaru Kyuragi
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Paper Abstract

Thick-gold-multilevel damascene-interconnect technology makes it possible to fabricate >10-micrometers -feature ultrahigh-speed devices on Si. Adding H2O2 to a conventional KIO3-based slurry triples the removal rate of gold in chemical mechanical polishing (CMP). A ratio of H2O2 to slurry of approximately 1:1 is found to be the optimum for obtaining the highest gold removal rate. X-ray photoelectron spectroscopy (XPS) analyses show that gold is oxidized in spite of its chemical stability when the removal rate is high. The gold is oxidized due to the reduction of iodine at the optimum H2O2 mixture ratio. This CMP of gold enabled us to make a thick (>10 micrometers ) gold-multilevel damascene-interconnection structure for the first time. Integration of full-wafer wafer-bonded uni-traveling carrier photodiodes (UTC-PDs) with the gold multilevel interconnections as coplanar waveguides (CPWs) on a Si wafer has been achieved using this gold-CMP process.

Paper Details

Date Published: 28 September 2001
PDF: 10 pages
Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); doi: 10.1117/12.442947
Show Author Affiliations
Hiromu Ishii, NTT Telecommunications Energy Labs. (Japan)
Shouji Yagi, NTT Telecommunications Energy Labs. (Japan)
Tadashi Minotani, NTT Telecommunications Energy Labs. (Japan)
Yakov Royter, NTT Telecommunications Energy Labs. (Japan)
Kazuhisa Kudou, NTT Advanced Technology Corp. (Japan)
Masaki Yano, NTT Advanced Technology Corp. (Japan)
Tadao Nagatsuma, NTT Telecommunications Energy Labs. (Japan)
Katsuyuki Machida, NTT Telecommunications Energy Labs. (Japan)
Hakaru Kyuragi, NTT Telecommunications Energy Labs. (Japan)


Published in SPIE Proceedings Vol. 4557:
Micromachining and Microfabrication Process Technology VII
Jean Michel Karam; John A. Yasaitis, Editor(s)

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