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Proceedings Paper

Integrated cavity wafer level chip size package for MEMS applications
Author(s): Danny Weiss; Doron Teomim; Avner P. Badihi; Gil Zilber
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Paper Abstract

The packaging of microelectromechanical devices is currently one of the most challenging in this emerging field. The available packaging technologies often provide large dimensions and expensive solutions, thereby limiting the market penetration of micro electromechanical devices. A wafer level chip scale package (WLCSP) with an integrated cavity above the active area of the device for microelectromechanical components is described. This WLCSP is designed for devices with mechanically moving components such as micromirrors, miniature gyroscopes, acceleration detectors, etc.

Paper Details

Date Published: 28 September 2001
PDF: 9 pages
Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); doi: 10.1117/12.442942
Show Author Affiliations
Danny Weiss, ShellCase Ltd. (Israel)
Doron Teomim, ShellCase Ltd. (Israel)
Avner P. Badihi, ShellCase Ltd. (Israel)
Gil Zilber, ShellCase Ltd. (Israel)

Published in SPIE Proceedings Vol. 4557:
Micromachining and Microfabrication Process Technology VII
Jean Michel Karam; John A. Yasaitis, Editor(s)

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