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Proceedings Paper

Stress relaxation of the micromachined coplanar waveguide
Author(s): Yanling Shi; Zongsheng Lai; Peisheng Xin
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Paper Abstract

Micromachined microwave coplanar waveguides were fabricated in standard CMOS technology and the hybrid etch technology. The coplanar waveguides have been suspend from the silicon substrate and third insertion loss was greatly improved. When fabricating the micromachined structures on a (100) wafer, stress was relaxed because of the different thermal expansion coefficients between silicon and SiO2 dielectric. This caused this structures deformed. Among all etching pattern we had adopted, the etching orientation along the (100) line of the wafer obtained the smaller stress relaxation, but costing the longest etching time. ON the other hand, the space between the open areas for etching needs to be designed carefully to obtain the best mechanical and electrical properties.

Paper Details

Date Published: 14 September 2001
PDF: 4 pages
Proc. SPIE 4414, International Conference on Sensor Technology (ISTC 2001), (14 September 2001); doi: 10.1117/12.440196
Show Author Affiliations
Yanling Shi, East China Normal Univ. (China)
Zongsheng Lai, East China Normal Univ. (China)
Peisheng Xin, East China Normal Univ. (China)

Published in SPIE Proceedings Vol. 4414:
International Conference on Sensor Technology (ISTC 2001)
Yikai Zhou; Shunqing Xu, Editor(s)

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