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Proceedings Paper

Three-Dimensional Imaging Sensors program
Author(s): Mark K. Browder; Bruno Evans; Jeffrey D. Beck; Michael A. Blessinger; Wolfram S. Blattner; Richard LeBlanc; Brian H. Miles
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Paper Abstract

This paper gives an overview of Lockheed Martin's effort as part the DARPA Three Dimensional Imaging Sensors Program. The overall system, the detector technology, the ROIC approaches, and the system model are discussed. The system approach has a laser transmitter that illuminates the entire sensor field-of-view (FOV) with a single laser pulse and collects the returned energy on a focal plane array (FPA) where each picture element (pixel) measures range. The detector is a short wavelength infrared HgCdTe APD array based on DRS Infrared Technology's well established architecture of HDVIP.. The ROICs implement 'on-chip' pixel level signal processing to generate 3-D imagery. The model is used to make predictions based on range, power, aperture, weather and FPA characteristics to help forecast expected device/readout/system performance.

Paper Details

Date Published: 19 September 2001
PDF: 11 pages
Proc. SPIE 4377, Laser Radar Technology and Applications VI, (19 September 2001); doi: 10.1117/12.440127
Show Author Affiliations
Mark K. Browder, Lockheed Martin Missiles and Fire Control (United States)
Bruno Evans, Lockheed Martin Missiles and Fire Control (United States)
Jeffrey D. Beck, DRS Infrared Technologies, LP (United States)
Michael A. Blessinger, DRS Infrared Technologies, LP (United States)
Wolfram S. Blattner, Lockheed Martin Missiles and Fire Control (United States)
Richard LeBlanc, Lockheed Martin Missiles and Fire Control (United States)
Brian H. Miles, Air Force Research Lab. (United States)


Published in SPIE Proceedings Vol. 4377:
Laser Radar Technology and Applications VI
Gary W. Kamerman, Editor(s)

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