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Proceedings Paper

Defect dispositioning using mask printability on attenuated phase-shift production photomasks
Author(s): Justin W. Novak; Benjamin George Eynon; Anja Rosenbusch; Alex Goldenshtein
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Paper Abstract

Recently a new mask qualification concept is getting more and more attention. Mask makers are challenged to meet mask and defect specifications of 130 and 100-nm technology node. This means very tight specifications, which usually lead to long mask delivery times. A main factor in the mask making process is mask inspection and repair. The mask repair cycle is not only time-consuming, but also bears the danger of damaging a mask. At the same time, when investigating defect printability, it is getting clear that a lot of today detected defects do not affect wafer-printing results at all. The concept Inspect all - Repair only what prints is introduced. In this paper a study comparing different defect classification methods and their impact on mask repair cycle time is presented.

Paper Details

Date Published: 5 September 2001
PDF: 11 pages
Proc. SPIE 4409, Photomask and Next-Generation Lithography Mask Technology VIII, (5 September 2001); doi: 10.1117/12.438407
Show Author Affiliations
Justin W. Novak, Photronics, Inc. (United States)
Benjamin George Eynon, Photronics, Inc. (United States)
Anja Rosenbusch, Etec Systems, Inc. (United States)
Alex Goldenshtein, Etec Systems, Inc. (Israel)

Published in SPIE Proceedings Vol. 4409:
Photomask and Next-Generation Lithography Mask Technology VIII
Hiroichi Kawahira, Editor(s)

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