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Proceedings Paper

Manufacturing and inspection of assist-bar-type OPC mask
Author(s): Masayoshi Tsuzuki; Wataru Nozaki; Shinji Akima; Jun Yoshida; Yuko Oi; Yoshiro Yamada; Yuichi Matsuzawa
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Paper Abstract

Be accompanied with gate length will tend to be smaller in LSI manufacturing, assist bar type OPC masks are vigorously investigated to take into mass production. In this research, we examined problems about manufacturing and guarantee of assist bar type OPC masks. We applied 50KeV-accelerated Vector-type E-beam system to mask manufacturing that is going to be a major equipment from now on. Firstly, we remarked the CD error that occurred in mask manufacturing, and the error was valuated. Secondly, we estimated the influence of mask accuracy to false defect occurrence. Lastly, we made the masks for defect check. The defects of the masks were measured using SEM, and wafer printability of the defects was checked by simulation. And we estimated the sensitivity of inspection. As results, it is proved to be possible that manufacturing and inspecting the assist bar type OPC masks in 100 nm node.

Paper Details

Date Published: 5 September 2001
PDF: 12 pages
Proc. SPIE 4409, Photomask and Next-Generation Lithography Mask Technology VIII, (5 September 2001); doi: 10.1117/12.438399
Show Author Affiliations
Masayoshi Tsuzuki, Toppan Printing Co., Ltd. (Japan)
Wataru Nozaki, Toppan Printing Co., Ltd. (Japan)
Shinji Akima, Toppan Printing Co., Ltd. (Japan)
Jun Yoshida, Toppan Printing Co., Ltd. (Japan)
Yuko Oi, Toppan Printing Co., Ltd. (Japan)
Yoshiro Yamada, Toppan Printing Co., Ltd. (Japan)
Yuichi Matsuzawa, Toppan Printing Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 4409:
Photomask and Next-Generation Lithography Mask Technology VIII
Hiroichi Kawahira, Editor(s)

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