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Proceedings Paper

Acid-breakable-resin-based chemical amplification positive resist for 0.1-um-rule reticle fabrication: design and lithographic performance
Author(s): Sonoko Migitaka; Tadashi Arai; Toshio Sakamizu; Kei Kasuya; Michiaki Hashimoto; Hiroshi Shiraishi
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Paper Abstract

We have designed a new chemical amplification (CA) positive resist for 0.1micrometers reticle fabrication. This positive resist consists of an acid-generator, an acid-diffusion controller, and an acid-breakable (AB) resin that can be converted to initial polyphenol units by an acid-catalyzed reaction. In the exposed region, main-chain scission of the AB resin matrix produces nearly mono-dispersed fragments (the polyphenol). This complete fragmentation results in an extremely high dissolution rate with an aqueous-base developer (tetramethylammonium hydroxide: 2.38 wt%). The AB resin-based resist enabled fabrication of scum free 0.15micrometers line-and-space patterns on a CrOx plate by using a 50-kV electron-beam reticle writer (HL series). The line- edge roughness of patterns delineated by this resist (<10 nm) was less than half that for previously developed novolak-resin-based CA resists (RE series:>30nm).

Paper Details

Date Published: 5 September 2001
PDF: 10 pages
Proc. SPIE 4409, Photomask and Next-Generation Lithography Mask Technology VIII, (5 September 2001); doi: 10.1117/12.438351
Show Author Affiliations
Sonoko Migitaka, Hitachi, Ltd. (Japan)
Tadashi Arai, Hitachi, Ltd. (Japan)
Toshio Sakamizu, Hitachi, Ltd. (Japan)
Kei Kasuya, Hitachi Chemical Co., Ltd. (Japan)
Michiaki Hashimoto, Hitachi Chemical Co., Ltd. (Japan)
Hiroshi Shiraishi, Hitachi, Ltd. (Japan)

Published in SPIE Proceedings Vol. 4409:
Photomask and Next-Generation Lithography Mask Technology VIII
Hiroichi Kawahira, Editor(s)

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