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Proceedings Paper

Investigation of electron beam stabilization of 193-nm photoresists
Author(s): Myoung-Soo Kim; Jong-Woon Park; Hak-Joon Kim; Bum-Jin Jun; Myung-Goon Gil; Bong-Ho Kim; Matthew F. Ross; William R. Livesay
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Paper Abstract

193nm lithography is a promising candidate for the fabrication of microelectronic devices at the 130nm design rule and below. With smaller feature sizes, below 130nm, reduced resist thickness is essential because of the pattern collapse issues at high aspect ratios and the limited depth of focus with 193nm lithography tools. However, ArF resists have shown problems with etch selectivity, especially with the thin resist layers necessary. Additionally, pattern slimming during CD-SEM measurement, due to the nature of the resist chemistry, is an issue with feature stability after patterning. At present, many studies have been performed for improving the etch selectivity of resists and addressing line slimming issues. In this study, the electron beam stabilization process has been applied for improving the etch selectivity of resist patterns having an aspect ratio less than 3.0. The electron beam stabilization has been applied to two different ArF resist types; acrylate and cyclic-olefin- maleic-anhydride (COMA), which have been evaluated with respect to materials properties, etch selectivity, and line slimming performance as a function of electron beam dose and etch condition. Film shrinkage and the change in index of refraction were monitored as a function of stabilization condition. The chemical properties were characterized before and after electron beam stabilization using FTIR analysis. Blanket resist etch rate studies were performed as a function of stabilization condition for each resist type. Cross- sectional views of resist patterns after etch processing were also investigated to evaluate the improvement in etch resistance provided by the electron beam process. CD SEM measurements were performed to evaluate the impact of the stabilization process on the patterned features. The issue of line slimming has also been evaluated, with and without electron beam stabilization, for the different ArF resist materials considered. The results were compared with a KrF resist currently used in production. Based on the experimental results, the electron beam process provides a method for improving etch selectivity and reducing line slimming issues of ArF resists.

Paper Details

Date Published: 24 August 2001
PDF: 14 pages
Proc. SPIE 4345, Advances in Resist Technology and Processing XVIII, (24 August 2001); doi: 10.1117/12.436905
Show Author Affiliations
Myoung-Soo Kim, Hyundai Electronics Industries Co., Ltd. (South Korea)
Jong-Woon Park, Hyundai Electronics Industries Co., Ltd. (South Korea)
Hak-Joon Kim, Hyundai Electronics Ind. Co. Ltd. (South Korea)
Bum-Jin Jun, Hyundai Electronics Industries Co., Ltd. (South Korea)
Myung-Goon Gil, Hyundai Electronics Industries Co., Ltd. (South Korea)
Bong-Ho Kim, Hyundai Electronics Industries Co., Ltd. (South Korea)
Matthew F. Ross, Electron Vision Corp. (United States)
William R. Livesay, Electron Vision Corp. (United States)


Published in SPIE Proceedings Vol. 4345:
Advances in Resist Technology and Processing XVIII
Francis M. Houlihan, Editor(s)

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