Share Email Print

Proceedings Paper

Advanced KrF chemical amplified photoresists for 0.13-um lithography
Author(s): Qunying Lin; Michael J. Sack
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

When critical dimension shrinks down to 0.12micrometers , lithography patterning becomes one of the major issues: limited process window, line edge roughness, CD error budget, and challenges on mask technology. Concurrently, 248nm and 193nm DUV lithography strategies are developed. However, with much concerns on 193nm lithography resists and exposure tool, 248nm lithography shows some advantages in availability of high er NA (0.7~0.8) tool, advanced resists and resolution enhancement technologies such as off-axis illumination, OPC and PSM technology. In this paper, we report development works done on 0.13micrometers gate patterning with 248nm advanced chemical amplified photoresists (CAR) annular illumination, OPC and half-tone PSM technology. The study shows that with newly development work on advanced 248nm photoresists, the process window can be enlarged to 0.60micrometers overlapping on both 0.12micrometers isolated and dense lines. Different formula impact greatly on resist profile, resist top loss and process latitudes. Annular illumination improves process latitudes, however bigger iso-dense bias is observed. Hence, OPC correction on iso-dense bias is very effective in this case. A 6% half tone PSM mask is used to improve resolution and process window in the study.

Paper Details

Date Published: 24 August 2001
PDF: 8 pages
Proc. SPIE 4345, Advances in Resist Technology and Processing XVIII, (24 August 2001); doi: 10.1117/12.436894
Show Author Affiliations
Qunying Lin, Chartered Semiconductor Manufacturing, Ltd. (Singapore)
Michael J. Sack, Chartered Semiconductor Manufacturing, Ltd. (Singapore)

Published in SPIE Proceedings Vol. 4345:
Advances in Resist Technology and Processing XVIII
Francis M. Houlihan, Editor(s)

© SPIE. Terms of Use
Back to Top