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Proceedings Paper

Development of an edge bead remover (EBR) for thick films
Author(s): Joseph E. Oberlander; Ernesto S. Sison; Craig Traynor; Jeff Griffin
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Paper Abstract

During the development of AZ EXP PLP 100XT thick film resist, the need for an effective Edge Bead Remover (EBR) was demonstrated for coatings of 50 microns. Because of the use of high solids content resist, a large amount of resist solvent was retained in the thick film coating as it was cast. Residual solvent can also come form the diffusion of the EBR solvent into the spreading resist. The residual solvent can significantly affect the EBR process and cause secondary flow problems such as rough edges stringers and reflow. Current EBRs such as AZ EBR 70/30, which is excellent for removing thin film residues, were not effective for use with resist coatings of 50 microns because of secondary flow issues. A number of solvents either along or in pairs were evaluated. From the sole solvent studies no strong correlation was seen between physical properties and EBR performance. However a weak correlation was seen between EBR performance and volatility. The EBR performance was further optimized by increasing its volatility. The optimized solvent system consists of a mixture of dimethyl carbonate (DMC) and cyclopentanone (CP). The dimethyl carbonate/cyclopentanone solvent system is significantly more volatile than the conventional EBRs such as AZ EBR 70.30. The cyclopentanone insures good edge cleaning. This system demonstrated good performance characteristics such as no secondary flow, sharp resist edge and a clean wafer edge. The safety issues of toxicity and flash point will also be discussed.

Paper Details

Date Published: 24 August 2001
PDF: 9 pages
Proc. SPIE 4345, Advances in Resist Technology and Processing XVIII, (24 August 2001); doi: 10.1117/12.436879
Show Author Affiliations
Joseph E. Oberlander, Clariant Corp. (United States)
Ernesto S. Sison, Clariant Corp. (United States)
Craig Traynor, Clariant Corp. (United States)
Jeff Griffin, Clariant Corp. (United States)


Published in SPIE Proceedings Vol. 4345:
Advances in Resist Technology and Processing XVIII
Francis M. Houlihan, Editor(s)

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