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Proceedings Paper

Impact of attenuated PSM repair for 130-nm polygate lithography process
Author(s): Xuelong Shi; Stephen Hsu; Robert John Socha; J. Fung Chen; Andy Cheng; Clyde Su; Jackie Cheng; Andy Chen; Henry Lin; David Wang; Dick Chen; Arthur Lin; Will Conley; Dan Metzger; Sunil Desai; Philip H. Imamura; Micheal J. Sherrill
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Paper Abstract

As the minimum feature size shrinks to 130nm region, attenuated phase shift mask (attPSM) with optical proximity correction (OPC) is reportedly as one of the potential methods to achieve manufacturable process by using 248nm exposure wavelength. For a typical mask making process, sometimes it is necessary to perform mask repairs to remove unwanted defects. Repairing either the OPC features or the attenuated phase-shifting main features present a new challenge in the mask making process. For both clear and opaque types of imperfect repairs, the repaired edge placement accuracy and/or transmission and phase shirt matching after repair may cause considerable amount of changes in the aerial images and then be transferred into resist patterns. Some imperfect repairs may become killer defects while others can significantly reduce the lithography process latitude, especially around the forbidden pitches. In our study, the effectiveness of defect repairs for 130nm gate attPSM at different pitches is assessed by direct examination from printed wafers.

Paper Details

Date Published: 22 August 2001
PDF: 9 pages
Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, (22 August 2001); doi: 10.1117/12.436797
Show Author Affiliations
Xuelong Shi, ASML MaskTools Inc. (United States)
Stephen Hsu, ASML MaskTools Inc. (United States)
Robert John Socha, ASML MaskTools Inc. (United States)
J. Fung Chen, ASML MaskTools Inc. (United States)
Andy Cheng, Precision Semiconductor Mask Corp. (Taiwan)
Clyde Su, Precision Semiconductor Mask Corp. (Taiwan)
Jackie Cheng, Precision Semiconductor Mask Corp. (Taiwan)
Andy Chen, Precision Semiconductor Mask Corp. (Taiwan)
Henry Lin, Precision Semiconductor Mask Corp. (Taiwan)
David Wang, Precision Semiconductor Mask Corp. (Singapore)
Dick Chen, Precision Semiconductor Mask Corp. (Taiwan)
Arthur Lin, Grand Technology, Inc. (Taiwan)
Will Conley, Motorola (United States)
Dan Metzger, Motorola (United States)
Sunil Desai, KLA-Tencor Corp. (United States)
Philip H. Imamura, KLA-Tencor (United States)
Micheal J. Sherrill, KLA-Tencor (United States)


Published in SPIE Proceedings Vol. 4344:
Metrology, Inspection, and Process Control for Microlithography XV
Neal T. Sullivan, Editor(s)

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