Share Email Print
cover

Proceedings Paper

Process development and impurities analysis for the bottom antireflective coating material
Author(s): Fu-Hsiang Ko; Hsuen-Li Chen; Tiao-Yuan Huang; Hsu-Chun Cheng; Chu-Jung Ko; Tieh-Chi Chu
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The optical behavior of semiconductor bottom antireflective coating (BARC) material was investigated by both the measurement and simulation methods. The effects of spin- coating rate, interface reflection, BARC layer thickness and photoresist layer thickness were studied. Our results indicated that the 62.5 nm of BARC layer had strong effect on suppressing the light reflection of wavelength of 248 nm form the wafer surface, irrespective of the photoresist layer thickness. Based on the gravimetric method, a high throughput and one-step microwave digestion procedure was developed for the BARC materials. The digestion efficiency increased with the digestion duration and the temperature. By following the established one-step microwave digestion method and inductively coupled plasma mass spectrometry determination, the detection limits obtained for Cr, Ni, Cu, An and Pb were in 0.1 to 1.11 ppb levels. The spike recoveries of the metallic impurities were in the range 86- 102% for the BARC materials. The analytical results of the BARC samples were found to be in reasonably good agreement with our previous method, and the analytical throughput can achieve up to 20 samples per hour for the analysis of 5 elements.

Paper Details

Date Published: 22 August 2001
PDF: 10 pages
Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, (22 August 2001); doi: 10.1117/12.436779
Show Author Affiliations
Fu-Hsiang Ko, National Nano Device Labs. (Taiwan)
Hsuen-Li Chen, National Nano Device Labs. (Taiwan)
Tiao-Yuan Huang, National Nano Device Labs. (Taiwan)
Hsu-Chun Cheng, National Tsing Hua Univ. (Taiwan)
Chu-Jung Ko, National Tsing Hua Univ. (Taiwan)
Tieh-Chi Chu, National Tsing Hua Univ. (Taiwan)


Published in SPIE Proceedings Vol. 4344:
Metrology, Inspection, and Process Control for Microlithography XV
Neal T. Sullivan, Editor(s)

© SPIE. Terms of Use
Back to Top