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Proceedings Paper

Haidinger interferometer for silicon wafer TTV measurement
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Paper Abstract

We describe a novel, IR phase shifting Haidinger fringe interferometer for measuring the thickness, total thickness variation (TTV) and bow of silicon wafers. We show that by taking 3 interferograms of the wafer in different positions in the cavity it is possible to separate thickness, TTV and bow. We also show that bow has an effect on the measurement of TTV.

Paper Details

Date Published: 22 August 2001
PDF: 10 pages
Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, (22 August 2001); doi: 10.1117/12.436775
Show Author Affiliations
Robert E. Parks, Optical Perspectives Group and NIST (United States)
Lianzhen Shao, Tucson Optical Research Corp. (United States)
Angela D. Davies, National Institute of Standards and Technology (United States)
Christopher J. Evans, National Institute of Standards and Technology (United States)


Published in SPIE Proceedings Vol. 4344:
Metrology, Inspection, and Process Control for Microlithography XV
Neal T. Sullivan, Editor(s)

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