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Proceedings Paper

Electromagnetic scatterometry applied to in-situ metrology
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Paper Abstract

In this paper we introduce the concept of single combined field integral equation to the rapidly developing field of in-line metrology employing scatterometry. The new method is very fast and accurate with extreme versatility, enabling very rapid profile analysis of periodic and isolated features. Several examples in 2D and 3D, such as T-top profiles, contact holes and entire SRAM cells, are presented.

Paper Details

Date Published: 22 August 2001
PDF: 12 pages
Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, (22 August 2001); doi: 10.1117/12.436773
Show Author Affiliations
Michael S. Yeung, Boston Univ. (United States)
Eytan Barouch, Boston Univ. (United States)


Published in SPIE Proceedings Vol. 4344:
Metrology, Inspection, and Process Control for Microlithography XV
Neal T. Sullivan, Editor(s)

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