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Proceedings Paper

Three-dimensional top-down metrology: a viable alternative to AFM or cross-section?
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Paper Details

Date Published: 22 August 2001
PDF: 11 pages
Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, (22 August 2001); doi: 10.1117/12.436762
Show Author Affiliations
Eric P. Solecky, IBM Advanced Semiconductor Technology Ctr. (United States)
Charles N. Archie, IBM Advanced Semiconductor Technology Ctr. (United States)
Timothy S. Hayes, IBM Microelectronics (United States)
G. William Banke, IBM Microelectronics (United States)
Roger S. Cornell, Applied Materials (United States)


Published in SPIE Proceedings Vol. 4344:
Metrology, Inspection, and Process Control for Microlithography XV
Neal T. Sullivan, Editor(s)

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