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Proceedings Paper

Evaluation of overlay performance by using air shower at the prealignment
Author(s): Amit Ghosh; Yew-Kong Tan; D. Arunagiri Rajan; Gin Ping Sun
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Paper Abstract

This paper demonstrates the impact of introducing air-shower unit over the stepper prealignment module on the overlay performance of 0.35micrometers process technology. There is a overall improvement in overlay by 8-12nm for the FEOL process (poly to active) and 25-30nm improvement for W-CMP BEOL process .

Paper Details

Date Published: 22 August 2001
PDF: 5 pages
Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, (22 August 2001); doi: 10.1117/12.436733
Show Author Affiliations
Amit Ghosh, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Yew-Kong Tan, Chartered Semiconductor Manufacturing Ltd. (Singapore)
D. Arunagiri Rajan, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Gin Ping Sun, Chartered Semiconductor Manufacturing Ltd. (Singapore)


Published in SPIE Proceedings Vol. 4344:
Metrology, Inspection, and Process Control for Microlithography XV
Neal T. Sullivan, Editor(s)

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