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Proceedings Paper

W-CMP alignment using ASML's ATHENA system on an I-line stepper
Author(s): K. John Prasad; D. Arunagiri Rajan; Yew-Kong Tan; Gin Ping Sun; Stephen Morgan; Merritt Phillips; Bruce Ng
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Paper Abstract

This paper demonstrates the overlay capability of ASML's ATHENA alignment system on I-line steppers for W-CMP processes. The evaluation presents the method used to find the best scribe-line marks, alignment recipe and the long term overlay capability of ATHENA for a 0.35micrometers device in a production environment. This alignment capability for W-CMP meets the overlay requirement for the 0.35micrometers process and thus leads to device yield improvement.

Paper Details

Date Published: 22 August 2001
PDF: 10 pages
Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, (22 August 2001); doi: 10.1117/12.436730
Show Author Affiliations
K. John Prasad, Chartered Semiconductor Manufacturing, Ltd. (Singapore)
D. Arunagiri Rajan, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Yew-Kong Tan, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Gin Ping Sun, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Stephen Morgan, ASML (Singapore)
Merritt Phillips, ASML (Taiwan)
Bruce Ng, Hermes-Epitek (Singapore)


Published in SPIE Proceedings Vol. 4344:
Metrology, Inspection, and Process Control for Microlithography XV
Neal T. Sullivan, Editor(s)

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