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Proceedings Paper

MEMS pressure belt with sensor interface and communication architecture
Author(s): Lee H. Eccles; Wayne Catlin; Mark J. Holland; Namsoo P. Kim; Larry Malchodi
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Paper Abstract

Boeing utilizes many different sensor types and their associated electronic systems for aircraft testing. An array of sensors are being used to determine the load on the wings of an aircraft. We have developed a MEMS sensor network, which takes advantage of this technology. In this paper, we report the development of a 'pressure belt' containing a electronic packaging configuration incorporating MEMS pressure sensors and multi-chip modules. A thin profile of less than 0.070 inch was required for aerodynamic reasons. The MCM substrate was fabricated on oxidized silicon using copper as the conductor and photo-sensitive polyimide as the dielectric material. Direct-chip-attachment (flip chip) process was used to bond the MEMS device to the module and the bus connection was conducted through embedded copper on a flex PCB to the host computer. An encapsulation material for the protection of the bare electronic components was selected for improving the reliability of the module. Improvements in the signal conditioning and processing are being incorporated into the pressure belt. The design includes a signal conditioning unit that includes analog to digital conversion, a digital filter, temperature compensation and conversion to engineering units.

Paper Details

Date Published: 16 August 2001
PDF: 8 pages
Proc. SPIE 4334, Smart Structures and Materials 2001: Smart Electronics and MEMS, (16 August 2001); doi: 10.1117/12.436615
Show Author Affiliations
Lee H. Eccles, The Boeing Co./Commercial Airplane Group (United States)
Wayne Catlin, The Boeing Co./Commercial Airplane Group (United States)
Mark J. Holland, The Boeing Co./Commercial Airplane Group (United States)
Namsoo P. Kim, The Boeing Co./Phantom Works (United States)
Larry Malchodi, The Boeing Co./Commercial Airplane Group (United States)


Published in SPIE Proceedings Vol. 4334:
Smart Structures and Materials 2001: Smart Electronics and MEMS
Vijay K. Varadan, Editor(s)

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