Share Email Print
cover

Proceedings Paper

Fabrication of microstructures and microdevices by the particle assemblage
Author(s): Mikihiko Kobayashi; Norio Shinya; Takehiro Dan; Hiroshi Fudouzi; Takeshi Konno; Mitsuru Egashira
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

We aim to fabricate microstructure and microdevices by integrating and arranging powder particles, i.e., the particle assemblage. We have developed three assembling techniques of the particles. The details of the assembling techniques and samples of the assembled microstructures are introduced. A manipulator is developed to manipulate and to weld metal particles by using a tungsten probe. Nickel alloy particles of 50 micrometers were piled on a gold substrate by the manipulator, and a leaning tower of the particles is fabricated. The array of the leaning tower is considered to act as an actuator. For the integration of a great number of particles, we developed another method based on the principle with the xerography. An electron beam or an ion beam is irradiated on an insulating substrate. An electrified pattern is formed on the substrate by the doped electron or doped ion. Fine particles are attracted to the pattern by the electrostatic force. Thus, we can arrange particles by immersing the substrate in the suspension of particles. The third is a productive method of ordered mixture by the electrostatic force. A self- thermostatic heater is made from the composite particles of BaTiO3 and In produced by the method.

Paper Details

Date Published: 16 August 2001
PDF: 8 pages
Proc. SPIE 4334, Smart Structures and Materials 2001: Smart Electronics and MEMS, (16 August 2001); doi: 10.1117/12.436610
Show Author Affiliations
Mikihiko Kobayashi, National Research Institute for Metals (Japan)
Norio Shinya, National Research Institute for Metals (Japan)
Takehiro Dan, National Research Institute for Metals (Japan)
Hiroshi Fudouzi, National Research Institute for Metals (Japan)
Takeshi Konno, National Research Institute for Metals (Japan)
Mitsuru Egashira, National Research Institute for Metals (Japan)


Published in SPIE Proceedings Vol. 4334:
Smart Structures and Materials 2001: Smart Electronics and MEMS
Vijay K. Varadan, Editor(s)

© SPIE. Terms of Use
Back to Top