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Proceedings Paper

Module/packaging technologies for optical components: current and future trends
Author(s): Masahiro Kobayashi; Achyut Kumar Dutta
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Paper Abstract

The basic design methodology and criteria required for packaging of optical components are reviewed, and the state-of-art of different types of the packaging technologies of laser modules and receiver modules are addressed. They are Mini-DIL DFB-LD module, wavelength-locker integrated laser module, 10 Gbps receiver module with integrated APD and preamplifier IC, and non-hermetic SMT module. Considerations on future packaging technologies and integrated optical components are also discussed.

Paper Details

Date Published: 30 July 2001
PDF: 11 pages
Proc. SPIE 4532, Active and Passive Optical Components for WDM Communication, (30 July 2001); doi: 10.1117/12.436020
Show Author Affiliations
Masahiro Kobayashi, Fujitsu Quantum Devices Ltd. (Japan)
Achyut Kumar Dutta, Fujitsu Compound Semiconductor, Inc. (United States)


Published in SPIE Proceedings Vol. 4532:
Active and Passive Optical Components for WDM Communication
Achyut Kumar Dutta; Abdul Ahad Sami Awwal; Niloy K. Dutta; Katsunari Okamoto, Editor(s)

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