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Proceedings Paper

Trench warfare!: fitting photons for fine-feature fabrication
Author(s): Jan Pieter Kuijten; Will Conley; Robert John Socha; Stephan van de Goor; Stephen Hsu; Dave Smith; Marc Oliveras; Kirk Strozenski
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Paper Abstract

The challenge is developing imaging solutions for 180 nm trench lithography that provides maximum overlapping process windows for imaging through pitch. The issue has been addressed first; through simulation to optimize illumination, secondly; with experimentation and the collection of data through dose and focus for a number of pitch sequences with several illumination conditions for each CD. Our problem is how to handle the comparison of many ED windows and still be able to determine which set of conditions provide the best result, the POP factor (Pitch Optimization Process) was determined. The authors will review the POP factor to demonstrate a possible new technique in the calculation of multiple pitch ED windows.

Paper Details

Date Published: 14 September 2001
PDF: 8 pages
Proc. SPIE 4346, Optical Microlithography XIV, (14 September 2001); doi: 10.1117/12.435714
Show Author Affiliations
Jan Pieter Kuijten, ASML (Netherlands)
Will Conley, Motorola (United States)
Robert John Socha, ASML (United States)
Stephan van de Goor, ASML (Netherlands)
Stephen Hsu, ASML (United States)
Dave Smith, Motorola (United States)
Marc Oliveras, Motorola (United States)
Kirk Strozenski, Motorola (United States)


Published in SPIE Proceedings Vol. 4346:
Optical Microlithography XIV
Christopher J. Progler, Editor(s)

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