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Proceedings Paper

Achieving low-wavefront specifications for DUV lithography: impact of residual stress in HPFS fused silica
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Paper Abstract

As optical lithographers push to extend optical lithography technologies to create smaller features with higher NA, lower k1 values and shorter wavelengths, transmitted wavefront specifications for HPFSR fused silica blanks continue to tighten. HPFSR fused silica blanks are typically certified for acceptance using an interferometer operating at a wavelength of 632.8 nm. As the market demands increasingly tighter homogeneity specifications, it has become critical to understand the sources of variation in wavefront measurements. Corning has recently initiated a study to identify those sources of variation. One glass attribute being studied is the impact of residual stress on the wavefront. It is known that residual stresses can alter the refractive index of fused silica. To obtain the residual stress measurements, birefringence measurements were obtained at 632.8 nm for comparison to wavefront measurements at 632.8 nm. The relationship between residual birefringence and transmitted wavefront measurements, at 632.8 nm on Corning HPFSR fused silica blanks, is explored in this paper.

Paper Details

Date Published: 14 September 2001
PDF: 8 pages
Proc. SPIE 4346, Optical Microlithography XIV, (14 September 2001); doi: 10.1117/12.435680
Show Author Affiliations
Julie L. Ladison, Corning Inc. (United States)
Joseph F. Ellison, Corning Inc. (United States)
Douglas C. Allan, Corning Inc. (United States)
David R. Fladd, Jacobian Technologies (United States)
Andrew W Fanning, Fanning Technical Services (United States)
Richard Priestley, Corning Inc. (United States)


Published in SPIE Proceedings Vol. 4346:
Optical Microlithography XIV
Christopher J. Progler, Editor(s)

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