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Proceedings Paper

Microscale bending using pulsed and cw laser
Author(s): X. Richard Zhang; Xianfan Xu; Andrew C. Tam
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Paper Abstract

The purpose of this work is to investigate microscale laser bending and to compare the results of bending using a pulsed and a CW laser. Samples of ceramics (Al2O3/TiC), silicon, and stainless steel are bent at various laser processing conditions. Changes of surface composition after laser irradiation are analyzed using an electron probe microanalyzer (EPMA). Comparisons of CW vs. pulsed bending are made in terms of the amount of bending and the damage to the specimens.

Paper Details

Date Published: 29 June 2001
PDF: 8 pages
Proc. SPIE 4274, Laser Applications in Microelectronic and Optoelectronic Manufacturing VI, (29 June 2001); doi: 10.1117/12.432552
Show Author Affiliations
X. Richard Zhang, Purdue Univ. (United States)
Xianfan Xu, Purdue Univ. (United States)
Andrew C. Tam, IBM Almaden Research Ctr. (United States)


Published in SPIE Proceedings Vol. 4274:
Laser Applications in Microelectronic and Optoelectronic Manufacturing VI
Malcolm C. Gower; Henry Helvajian; Koji Sugioka; Jan J. Dubowski, Editor(s)

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