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Proceedings Paper

F2 lasers: high-resolution optical processing system for shaping photonic components
Author(s): Peter R. Herman; Kevin P. Chen; Xiaoli Midori Wei; Jie Zhang; Juergen Ihlemann; Dirk Schaefer; Gerd Marowsky; Peter Oesterlin; Berthold Burghardt
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Paper Abstract

A high-resolution 157-nm optical system has been developed for the first time to microprocess optical materials with record short-wavelength F2-laser radiation. The F2-laser photons drive strong material interactions in silica glasses for microsculpting surfaces and for imprinting internal refractive index structures. The high-resolution optics deliver a homogenized beam of high on-target fluence (approximately 2.5 J/cm2) for ablation of fused silica and other wide bandgap optical materials. The system resolution is approaching 1-micron lateral and less than 100-nm depth - sub-wavelength features appropriate for defining optical communication components at 1.55-micrometers wavelength. This paper describes this novel processing system and offers prospects for F2-laser microfabrication and trimming of photonic components in the telecommunication and general optics manufacturing fields.

Paper Details

Date Published: 29 June 2001
PDF: 9 pages
Proc. SPIE 4274, Laser Applications in Microelectronic and Optoelectronic Manufacturing VI, (29 June 2001); doi: 10.1117/12.432547
Show Author Affiliations
Peter R. Herman, Univ. of Toronto (Canada)
Kevin P. Chen, Univ. of Toronto (Canada)
Xiaoli Midori Wei, Univ. of Toronto (Canada)
Jie Zhang, Univ. of Toronto (Canada)
Juergen Ihlemann, Laser-Lab. Goettingen e.V. (Germany)
Dirk Schaefer, Laser-Lab. Goettingen e.V. (Germany)
Gerd Marowsky, Laser-Lab. Goettingen e.V. (Germany)
Peter Oesterlin, MicroLas Lasersystem GmbH (Germany)
Berthold Burghardt, MicroLas Lasersystem GmbH (Germany)


Published in SPIE Proceedings Vol. 4274:
Laser Applications in Microelectronic and Optoelectronic Manufacturing VI
Malcolm C. Gower; Henry Helvajian; Koji Sugioka; Jan J. Dubowski, Editor(s)

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