Share Email Print

Proceedings Paper

Prototype laser-activated bimetallic thermal resist for microfabrication
Author(s): Marinko V. Sarunic; Glenn H. Chapman; Richard Yuqiang Tu
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The Thermal Resist Enhanced Optical Lithography (TREOL) process models an optical system to double device resolution by exploiting non-reciprocal laser activated processes. A possible prototype thermal resist consists of stacked bismuth on indium layers sputter deposited on a glass/quartz substrate with thickness ratios matching the eutectic alloy (Bi 53%). Laser radiation locally melts the metals which alloy upon cooling. BiIn resist is relatively wavelength insensitive because its UV optical characteristics vary modestly. Reflection and energy absorption/cc calculations indicate the best arrangement is a 30-45-nm total thickness bilayer with bismuth on indium. Exposing the highly absorbing BiIn with CW argon (514/488 nm) or 4-ns Nd:YAG pulses at 533 nm (40 mJ/cm2 for 300-nm thick) and 266 nm transforms the resist to a weakly absorbing alloy with a visually identifiable pattern. 30-nm thick converted film transmission changes from 1.0OD to 0.35OD (830-350 nm) until a 350-nm absorption edge. Profilometry and SEM showed no signs of ablation or oxide growth in exposed areas. The resist was developed with HNO3:CH3COOH:H2O etch, preferentially removing unexposed areas, leaving written patterns of alloyed lines seen both in profilometry and SEM images. Thus BiIn forms a complete thermal alloying resist with selectively etched exposed patterns that can be stripped in an HCl:H2O2:H2O bath.

Paper Details

Date Published: 29 June 2001
PDF: 11 pages
Proc. SPIE 4274, Laser Applications in Microelectronic and Optoelectronic Manufacturing VI, (29 June 2001); doi: 10.1117/12.432509
Show Author Affiliations
Marinko V. Sarunic, Simon Fraser Univ. (Canada)
Glenn H. Chapman, Simon Fraser Univ. (Canada)
Richard Yuqiang Tu, Simon Fraser Univ. (Canada)

Published in SPIE Proceedings Vol. 4274:
Laser Applications in Microelectronic and Optoelectronic Manufacturing VI
Malcolm C. Gower; Henry Helvajian; Koji Sugioka; Jan J. Dubowski, Editor(s)

© SPIE. Terms of Use
Back to Top