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Proceedings Paper

Multiwavelength excitation process of fused-silica by combination of F2 and KrF excimer lasers
Author(s): Kotaro Obata; Koji Sugioka; Toshimitsu Akane; Naoko Aoki; Koichi Toyoda; Katsumi Midorikawa
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Paper Abstract

Collinear irradiation system of VUV-UV multiwavelength excitation process using F2 and KrF excimer lasers has been developed. This system achieves high-quality ablation of fused silica. In addition, dependence of ablation rate on various conditions such as laser fluence, delay time of each laser irradiation, and pulse number is investigated. Multiwavelength excitation effect is strongly affected by the delay time and extremely high etching rate over 30 nm/pulse is obtained during -10 ns to 10 ns of the delay time. KrF excimer laser ablation threshold decreases and its effective absorption coefficient increases with increasing simultaneously irradiated F2 laser fluence.

Paper Details

Date Published: 29 June 2001
PDF: 8 pages
Proc. SPIE 4274, Laser Applications in Microelectronic and Optoelectronic Manufacturing VI, (29 June 2001); doi: 10.1117/12.432506
Show Author Affiliations
Kotaro Obata, RIKEN-The Institute of Physical and Chemical Research and Science Univ. of Tokyo (Japan)
Koji Sugioka, RIKEN-The Institute of Physical and Chemical Research (Japan)
Toshimitsu Akane, RIKEN-The Institute of Physical and Chemical Research (Japan)
Naoko Aoki, RIKEN-The Institute of PHysical and Chemical Research Science Univ. of Tokyo (Japan)
Koichi Toyoda, Science Univ. of Tokyo (Japan)
Katsumi Midorikawa, RIKEN-The Institute of Physical and Chemical Research (Japan)


Published in SPIE Proceedings Vol. 4274:
Laser Applications in Microelectronic and Optoelectronic Manufacturing VI
Malcolm C. Gower; Henry Helvajian; Koji Sugioka; Jan J. Dubowski, Editor(s)

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