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Proceedings Paper

Flex-Patch: a highly flexible piezoceramic composite with attached electrical leads
Author(s): Garnett C. Horner; John Teter; Eugene Robbins
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Paper Abstract

A new packaging technique for piezoceramic wafers is presented in which encapsulation of the piezoceramic incorporates the electrical leads. This technique for encapsulation produces a hermetically sealed package that also is flexible. The resulting product is called Flex-Patch because of the high flexibility. Micro-graphs of the flexed piezoceramic show that despite micro-cracking within the ceramic there is little, if any, loss in performance. Flex-Patch may be surface mounted or embedded into composites.

Paper Details

Date Published: 14 June 2001
PDF: 10 pages
Proc. SPIE 4332, Smart Structures and Materials 2001: Industrial and Commercial Applications of Smart Structures Technologies, (14 June 2001); doi: 10.1117/12.429665
Show Author Affiliations
Garnett C. Horner, NASA Langley Research Ctr. (United States)
John Teter, NASA Langley Research Ctr. (United States)
Eugene Robbins, NASA Langley Research Ctr. (United States)


Published in SPIE Proceedings Vol. 4332:
Smart Structures and Materials 2001: Industrial and Commercial Applications of Smart Structures Technologies
Anna-Maria Rivas McGowan, Editor(s)

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