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Proceedings Paper

Development of displacement and force measurement system for punching test of rigid copper clad laminates
Author(s): Quang-Cherng Hsu
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Paper Abstract

In this paper, a measurement system for punching test of small holes in rigid copper clad laminates is presented. Copper clad laminate is a main raw material of consumer electronics, information and telecommunications devices. The process parameters such as blank temperature, blank thickness and material specifications strongly relate to the characteristics of the punching forces and displacements in copper clad laminates. The proposed system consists of small scale force transducer, displacement transducer and data acquisition system, with which the punching forces can be measured in each punch steps. A small punch with outer diameter 2 mm is directly connected to force transducer to measure the pushing and pulling forces during hole-punching process. Bushings and guide pins are used inside the die configuration in order to ensure the path straightness when punch moves into the die cavity. The experimental result show that the increase of punch and die clearances decreases the punching forces. The same consequence is obtained when increase of blank temperatures. In the final part of the proposed paper, a computer-aided analysis package ANSYS is used to verify the deformation and strain of the punch in the small hole-punching process. The punch's elastic deformation is small compared with blank thickness. The maximum equivalent Von-Mises stress in punch is smaller than its fracture stress. The research results are useful database when designing requirements of punch and ejecting force during at press factory.

Paper Details

Date Published: 13 June 2001
PDF: 6 pages
Proc. SPIE 4317, Second International Conference on Experimental Mechanics, (13 June 2001); doi: 10.1117/12.429599
Show Author Affiliations
Quang-Cherng Hsu, National Kaohsiung Univ. of Applied Sciences (Taiwan)

Published in SPIE Proceedings Vol. 4317:
Second International Conference on Experimental Mechanics
Fook Siong Chau; Chenggen Quan, Editor(s)

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