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Proceedings Paper

Thermal deformation measurement of electronic packaging component using AFM scanning moire method
Author(s): Huimin Xie; Gin Boay Chai; Anand Krishna Asundi; Yu Jin; Yunguang Lu; Bryan Kok Ann Ngoi; Zhaowei Zhong
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Paper Abstract

The AFM scanning moire method was proposed to measure the in-plane deformation in the micrometer scale. The principle and technique for measuring in-plane deformation using AFM scanning moire method are described. This method was applied to measure the thermal deformation in a quad flat pack (QFP) electronic package at 100 degrees C. The normal strain component (epsilon) y and the shear strain component(gamma) xy near the die in the QFP package were measured.

Paper Details

Date Published: 13 June 2001
PDF: 6 pages
Proc. SPIE 4317, Second International Conference on Experimental Mechanics, (13 June 2001); doi: 10.1117/12.429567
Show Author Affiliations
Huimin Xie, Nanyang Technological Univ. (Singapore)
Gin Boay Chai, Nanyang Technological Univ. (Singapore)
Anand Krishna Asundi, Nanyang Technological Univ. (Singapore)
Yu Jin, Nanyang Technological Univ. (Singapore)
Yunguang Lu, Nanyang Technological Univ. (Singapore)
Bryan Kok Ann Ngoi, Nanyang Technological Univ. (Singapore)
Zhaowei Zhong, Nanyang Technological Univ. (Singapore)

Published in SPIE Proceedings Vol. 4317:
Second International Conference on Experimental Mechanics
Fook Siong Chau; Chenggen Quan, Editor(s)

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