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Proceedings Paper

Use of optical technique for inspection of warpage of IC packages
Author(s): Siew-Lok Toh; Fook Siong Chau; Sim Heng Ong
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Paper Abstract

The packaging of IC packages has changed over the years, form dual-in-line, wire-bond, and pin-through-hole in printed wiring board technologies in the 1970s to ball grid array, chip scale and surface mount technologies in the 1990s. Reliability has been a big problem for manufacturers for some moisture-sensitive packages. One of the potential problems in plastic IC packages is moisture-induced popcorn effect which can arise during the reflow process. Shearography is a non-destructive inspection technique that may be used to detect the delamination and warpage of IC packages. It is non-contacting and permits a full-field observation of surface displacement derivatives. Another advantage of this technique is that it is able to give the real-time formation of the fringes which indicate flaws in the IC package under real-time simulation condition of Surface Mount Technology (SMT) IR reflow profile. It is extremely fast and convenient to study the true behavior of the packaging deformation during the SMT process. It can be concluded that shearography has the potential for the real- time detection, in situ and non-destructive inspection of IC packages during the surface mount process.

Paper Details

Date Published: 13 June 2001
PDF: 6 pages
Proc. SPIE 4317, Second International Conference on Experimental Mechanics, (13 June 2001); doi: 10.1117/12.429546
Show Author Affiliations
Siew-Lok Toh, National Univ. of Singapore (Singapore)
Fook Siong Chau, National Univ. of Singapore (Singapore)
Sim Heng Ong, National Semiconductor Manufacturer Singapore Pte Ltd. (Singapore)


Published in SPIE Proceedings Vol. 4317:
Second International Conference on Experimental Mechanics
Fook Siong Chau; Chenggen Quan, Editor(s)

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