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Proceedings Paper

Silicon infrared focal plane arrays
Author(s): Masafumi Kimata; Hirofumi Yagi; Masashi Ueno; Junji Nakanishi; Tomohiro Ishikawa; Yoshiyuki Nakaki; Makoto Kawai; Kazuyo Endo; Yasuhiro Kosasayama; Yasuaki Ohota; Takashi Sugino; Takanori Sone
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Paper Abstract

Using Si VLSI technology, we can fabricate various kinds of infrared focal plane arrays (FPAs) which cover spectral bands from short wavelength infrared to long wavelength infrared. The Si-based technology offers many attractive features, such as monolithic integration, high uniformity, low noise, low cost, and high productivity. We have been developing Si-based infrared FPAs for more than 20 years and have verified their usefulness.

Paper Details

Date Published: 12 June 2001
PDF: 12 pages
Proc. SPIE 4288, Photodetectors: Materials and Devices VI, (12 June 2001); doi: 10.1117/12.429416
Show Author Affiliations
Masafumi Kimata, Mitsubishi Electric Corp. (Japan)
Hirofumi Yagi, Mitsubishi Electric Corp. (Japan)
Masashi Ueno, Mitsubishi Electric Corp. (Japan)
Junji Nakanishi, Mitsubishi Electric Corp. (Japan)
Tomohiro Ishikawa, Mitsubishi Electric Corp. (Japan)
Yoshiyuki Nakaki, Mitsubishi Electric Corp. (Japan)
Makoto Kawai, Mitsubishi Electric Corp. (Japan)
Kazuyo Endo, Mitsubishi Electric Corp. (Japan)
Yasuhiro Kosasayama, Mitsubishi Electric Corp. (Japan)
Yasuaki Ohota, Mitsubishi Electric Corp. (Japan)
Takashi Sugino, Mitsubishi Electric Corp. (Japan)
Takanori Sone, Mitsubishi Electric Corp. (Japan)


Published in SPIE Proceedings Vol. 4288:
Photodetectors: Materials and Devices VI
Gail J. Brown; Manijeh Razeghi, Editor(s)

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